products details

Home Products

High Frequency HF PCB Multilayer Printed Circuit Board for Antenna System

Name: High Frequency HF PCB Multilayer Printed Circuit Board for Antenna System
Brand: Shenzhen Tecircuit Electronics Limited
SKU: TEC0162
Price: 5.99 USD
Availability: InStock

Brand Name:	TECircuit
Model Number:	TEC0162
MOQ:	1pcs
Price:	USD 1.99 ~ USD9.99/pcs
Delivery Time:	5-15 wotk days
Payment Terms:	L/C, D/A, D/P, T/T, Western Union, MoneyGram

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W

Brand:

Shenzhen Tecircuit Electronics Co., Ltd

Product Type:

PCB,High Frequency Board,RIGID PCB,Rigid Board,Flexible Board,Rigid-Flex PCB,IC-Substrate,Metal Core

Item No.:

R0065

Service:

PCBA Service

Packaging Details:

Vacuum package+Carton box

Supply Ability:

50000 pcs/month

Highlight:

High Frequency HF PCB Multilayer

Antenna System HF PCB

HF Multilayer Printed Circuit Board

Product Description

Product Images

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

Wireless Communication:
- Used in antennas for mobile phones, tablets, and other wireless devices to facilitate communication over various frequency bands (e.g., GSM, LTE, 5G).
Satellite Communication:
- Employed in satellite antennas for both uplink and downlink transmission, ensuring reliable communication with orbiting satellites.
RFID Systems:
- Integrated into RFID (Radio-Frequency Identification) readers and tags, enabling contactless data exchange and tracking.
Wi-Fi and Bluetooth Devices:
- Used in Wi-Fi routers, access points, and Bluetooth devices to enhance wireless connectivity and range.
IoT Devices:
- Employed in Internet of Things (IoT) applications, facilitating communication between sensors and central systems.
Radar Systems:
- Integrated into radar antennas for applications in aviation, automotive, and defense, enhancing detection and tracking capabilities.
Television Broadcasting:
- Used in antennas for terrestrial and satellite television, ensuring high-quality signal reception.
Microwave Communication:
- Employed in microwave antennas for point-to-point communication links, often used in telecommunications.
Medical Devices:
- Integrated into medical telemetry systems for wireless patient monitoring and data transmission.
Industrial Automation:
- Used in antennas for industrial communication systems, enabling reliable data exchange in automation processes.

Product Features

Low Loss Dielectric Material:
- Made from materials with low dielectric loss to minimize signal degradation, ensuring efficient performance at high frequencies.
High Precision Manufacturing:
- Requires tight tolerances and high-quality finishes to maintain performance characteristics in antenna applications.
Controlled Impedance:
- Designed to maintain specific impedance levels (commonly 50 ohms or 75 ohms) to prevent signal reflections and ensure efficient power transfer.
Multi-layer Construction:
- Often utilizes multi-layer designs to optimize routing and shield sensitive components from interference.
Thermal Stability:
- Capable of withstanding temperature fluctuations, ensuring reliable operation in various environments.
Enhanced Signal Integrity:
- Supports high-frequency operations with minimal signal loss, critical for effective antenna performance.
Customizable Designs:
- Can be tailored to specific antenna configurations, such as patch antennas, monopole antennas, or array antennas.
Durability:
- Built to withstand harsh environmental conditions, ensuring long-term reliability in outdoor applications.
Regulatory Compliance:
- Designed to meet industry standards for safety and performance, ensuring dependable operation in various communication settings.
Ease of Integration:
- Compatible with standard electronic components and systems, facilitating seamless integration into existing applications.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

Tags:

Products Details

Home Products

High Frequency PCB

High Frequency HF PCB Multilayer Printed Circuit Board for Antenna System

All Category

High Frequency HF PCB Multilayer Printed Circuit Board for Antenna System

Brand Name:	TECircuit
Model Number:	TEC0162
MOQ:	1pcs
Price:	USD 1.99 ~ USD9.99/pcs
Packaging Details:	Vacuum package+Carton box
Payment Terms:	L/C, D/A, D/P, T/T, Western Union, MoneyGram

Detail Information

Product Description

Detail Information

Place of Origin:

China

Brand Name:

TECircuit

Certification:

UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W

Model Number:

TEC0162

Brand:

Shenzhen Tecircuit Electronics Co., Ltd

Product Type:

PCB,High Frequency Board,RIGID PCB,Rigid Board,Flexible Board,Rigid-Flex PCB,IC-Substrate,Metal Core

Item No.:

R0065

Service:

PCBA Service

Minimum Order Quantity:

1pcs

Price:

USD 1.99 ~ USD9.99/pcs

Packaging Details:

Vacuum package+Carton box

Delivery Time:

5-15 wotk days

Payment Terms:

L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability:

50000 pcs/month

Highlight:

High Frequency HF PCB Multilayer

Antenna System HF PCB

HF Multilayer Printed Circuit Board

Product Description

Product Images

About TECircuit

Product Applications

Wireless Communication:
- Used in antennas for mobile phones, tablets, and other wireless devices to facilitate communication over various frequency bands (e.g., GSM, LTE, 5G).
Satellite Communication:
- Employed in satellite antennas for both uplink and downlink transmission, ensuring reliable communication with orbiting satellites.
RFID Systems:
- Integrated into RFID (Radio-Frequency Identification) readers and tags, enabling contactless data exchange and tracking.
Wi-Fi and Bluetooth Devices:
- Used in Wi-Fi routers, access points, and Bluetooth devices to enhance wireless connectivity and range.
IoT Devices:
- Employed in Internet of Things (IoT) applications, facilitating communication between sensors and central systems.
Radar Systems:
- Integrated into radar antennas for applications in aviation, automotive, and defense, enhancing detection and tracking capabilities.
Television Broadcasting:
- Used in antennas for terrestrial and satellite television, ensuring high-quality signal reception.
Microwave Communication:
- Employed in microwave antennas for point-to-point communication links, often used in telecommunications.
Medical Devices:
- Integrated into medical telemetry systems for wireless patient monitoring and data transmission.
Industrial Automation:
- Used in antennas for industrial communication systems, enabling reliable data exchange in automation processes.

Product Features

Low Loss Dielectric Material:
- Made from materials with low dielectric loss to minimize signal degradation, ensuring efficient performance at high frequencies.
High Precision Manufacturing:
- Requires tight tolerances and high-quality finishes to maintain performance characteristics in antenna applications.
Controlled Impedance:
- Designed to maintain specific impedance levels (commonly 50 ohms or 75 ohms) to prevent signal reflections and ensure efficient power transfer.
Multi-layer Construction:
- Often utilizes multi-layer designs to optimize routing and shield sensitive components from interference.
Thermal Stability:
- Capable of withstanding temperature fluctuations, ensuring reliable operation in various environments.
Enhanced Signal Integrity:
- Supports high-frequency operations with minimal signal loss, critical for effective antenna performance.
Customizable Designs:
- Can be tailored to specific antenna configurations, such as patch antennas, monopole antennas, or array antennas.
Durability:
- Built to withstand harsh environmental conditions, ensuring long-term reliability in outdoor applications.
Regulatory Compliance:
- Designed to meet industry standards for safety and performance, ensuring dependable operation in various communication settings.
Ease of Integration:
- Compatible with standard electronic components and systems, facilitating seamless integration into existing applications.

FAQ

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

Tags:

Multilayer PCB

Industrial Control PCB Assembly

HDI PCB

Consumer Electronics PCB Assembly

Quick Turn PCB Assembly

Rigid Flexible PCB

2 Layer PCB

Communication PCB Assembly

Automotive PCB Assembly

FPC Flexible PCB

High Frequency PCB

Gold Finger PCB

Metal Core PCB

IC Substrate PCB

Ceramic PCB Board

Electronic Components

Multilayer PCB

Industrial Control PCB Assembly

HDI PCB

Consumer Electronics PCB Assembly

Quick Turn PCB Assembly

Rigid Flexible PCB

2 Layer PCB

Communication PCB Assembly

Automotive PCB Assembly

FPC Flexible PCB

High Frequency PCB

Gold Finger PCB

Metal Core PCB

IC Substrate PCB

Ceramic PCB Board

Electronic Components

products details

High Frequency HF PCB Multilayer Printed Circuit Board for Antenna System

High Frequency HF PCB Multilayer

Antenna System HF PCB

HF Multilayer Printed Circuit Board

Product Features

Products Details

Multilayer PCB

Industrial Control PCB Assembly

HDI PCB

Consumer Electronics PCB Assembly

Quick Turn PCB Assembly

Rigid Flexible PCB

2 Layer PCB

Communication PCB Assembly

Automotive PCB Assembly

FPC Flexible PCB

High Frequency PCB

Gold Finger PCB

Metal Core PCB

IC Substrate PCB

Ceramic PCB Board

Electronic Components

High Frequency HF PCB Multilayer Printed Circuit Board for Antenna System

High Frequency HF PCB Multilayer

Antenna System HF PCB

HF Multilayer Printed Circuit Board

Product Features