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Multilayer PCB
Created with Pixso. OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides

OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides

Brand Name: TECircuit
Model Number: TEC0005
MOQ: 1pcs
Price: USD 1.99 ~ USD9.99/pcs
Delivery Time: 5-15 wotk days
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Detail Information
Place of Origin:
China
Certification:
UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Brand:
Shenzhen Tecircuit Electronics Co., Ltd
Product Type:
PCB,High Frequency Board,RIGID PCB,Rigid-Flex PCB,IC-Substrate,Metal Core
Item No.:
R0004
Price:
Negotiable
Packaging Details:
Vacuum package+Carton box
Supply Ability:
50000 pcs/month
Highlight:

OEM Multilayer Printed Circuit Board

,

1.2mm Multilayer RIGID PCB

,

160x86 Multi Layer Pcb Board

Product Description
Product Description
Application:communication
Layer Count:6
Material:FR-4
Thickness:1.2mm
Min.Hole Size:0.2mm
Dimension:160*86
Surface Finish:ENIG
Special Feature:Semi-metalized trough on four sides
Product Image
OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides 0OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides 1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TECircuit Capability


1. Schematic development and PCB layout(what we use is Protel, PADS)
2. PCB fabrication from 1-40 layers. (single side, double side, multi-layer, HDI board, bury and blind holes board etc)
3. Material procurement and management
4. Prototype and NPI (new product introduction)
5. PCBA (SMD Placement include 0402,QFP,QFN,BGA etc )and through hole assembly, in-circuit test and functional testing)
6. IC pre-programming and Function verification & burning test
7. Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)
8. Environmental Coating
9. Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure and pac

 

Good price online

Products Details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Multilayer PCB
Created with Pixso. OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides

OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides

Brand Name: TECircuit
Model Number: TEC0005
MOQ: 1pcs
Price: USD 1.99 ~ USD9.99/pcs
Packaging Details: Vacuum package+Carton box
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Detail Information
Place of Origin:
China
Brand Name:
TECircuit
Certification:
UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Model Number:
TEC0005
Brand:
Shenzhen Tecircuit Electronics Co., Ltd
Product Type:
PCB,High Frequency Board,RIGID PCB,Rigid-Flex PCB,IC-Substrate,Metal Core
Item No.:
R0004
Price:
Negotiable
Minimum Order Quantity:
1pcs
Price:
USD 1.99 ~ USD9.99/pcs
Packaging Details:
Vacuum package+Carton box
Delivery Time:
5-15 wotk days
Payment Terms:
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability:
50000 pcs/month
Highlight:

OEM Multilayer Printed Circuit Board

,

1.2mm Multilayer RIGID PCB

,

160x86 Multi Layer Pcb Board

Product Description
Product Description
Application:communication
Layer Count:6
Material:FR-4
Thickness:1.2mm
Min.Hole Size:0.2mm
Dimension:160*86
Surface Finish:ENIG
Special Feature:Semi-metalized trough on four sides
Product Image
OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides 0OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides 1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TECircuit Capability


1. Schematic development and PCB layout(what we use is Protel, PADS)
2. PCB fabrication from 1-40 layers. (single side, double side, multi-layer, HDI board, bury and blind holes board etc)
3. Material procurement and management
4. Prototype and NPI (new product introduction)
5. PCBA (SMD Placement include 0402,QFP,QFN,BGA etc )and through hole assembly, in-circuit test and functional testing)
6. IC pre-programming and Function verification & burning test
7. Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)
8. Environmental Coating
9. Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure and pac