Rogers Corporation is a world-renowned manufacturer of high-performance materials, particularly specialized in producing a wide range of sheet materials for electronics and electrical engineering. Rogers sheet materials are renowned in the high-tech industry for their superior electrical properties, thermal stability, and mechanical strength. Below is an introduction to several common Rogers sheet materials and their technical specifications.

Rogers Sheet Material Introduction

1. RO4000® Series

RO4000 series sheets are Rogers Corporation's high-performance circuit board materials, particularly suited for high-frequency applications. These sheets are commonly used in wireless infrastructure, satellite communications, and radar systems.

RO4003C™: Features a higher dielectric constant, suitable for applications requiring higher capacitance values.

RO4350B™: Offers extremely low dielectric constant and dissipation factor, suitable for high-speed signal transmission.

2. RO300™ Series

Renowned for its flexibility and durability, the RO300 series sheets are suitable for flexible circuit boards and wearable devices.

RO3003™: A PTFE-based sheet with excellent flexibility and electrical properties.

3. ROG™ Ceramic-Based Sheet

ROG series sheets are recognized for their high thermal conductivity and excellent electrical insulation properties, making them suitable for high-power amplifiers and RF power devices.

4. 3200™ Series

3200 series sheets offer balanced electrical and mechanical properties, suitable for a wide range of electronic applications, including multi-layer panels and rigid circuit boards.

3210™: Features a medium dielectric constant and dissipation factor, suitable for general electronic and electrical applications.

5. 9000™ Series

9000 series sheets are Rogers Corporation's high-performance circuit board materials, renowned for their high-temperature resistance and excellent mechanical properties. They are suitable for applications requiring high reliability, such as aerospace and military electronics.

6. BT™ Series

BT series sheets are another high-performance material from Rogers Corporation, favored for their excellent thermal management capabilities and electrical performance, and are commonly used in power converters and LED lighting.

7. PORON® Series

PORON® is a microcellular polyurethane foam known for its excellent compression recovery and durability. It is commonly used for sealing and vibration damping in electronic equipment.

8. SE™ Series

SE Series sheet is Rogers Corporation's electromagnetic shielding material, effectively blocking electromagnetic interference and protecting sensitive electronic equipment.

RO4350B™ Series

Dielectric Constant (Dk): 2.2

Dissipation Factor (Df): 0.0002 (typical, @10 GHz)

Thermal Conductivity: 0.25 W/m·K

Operating Temperature Range: -65°C to +260°C

RO4003C™ Series

Dielectric Constant (Dk): 3.48

Dissipation Factor (Df): 0.005 (typical, @10 GHz)

Thermal Conductivity: 0.6 W/m·K

Operating Temperature Range: -65°C to +200°C

RO3003™ Series

Dielectric Constant (Dk): 2.17

Dissipation Factor (Df): 0.0009 (typical, @10 GHz)

Thermal Conductivity: 0.2 W/m·K

Operating Temperature Range: -65°C to +250°C

ROG™ Ceramic-Based Board

Dielectric Constant (Dk): Varies by product

Dissipation Factor (Df): Extremely low, specific values vary by product

Thermal Conductivity: High, specific values vary by product

Operating Temperature Range: -55°C to +200°C

3210™ Series

Dielectric Constant (Dk): 2.0

Dissipation Factor (Df): 0.001 (typical, @10 GHz)

Thermal Conductivity: 0.22 W/m·K

Operating Temperature Range: -65°C to +250°C

370HR™ Series

Dielectric Constant (Dk): 2.0

Dissipation Factor (Df): 0.001 (typical, @10 GHz)

Thermal Conductivity: 0.7 W/m·K

Operating Temperature Range: -65°C to +260°C

Production Process

Rogers PCBs (Printed Circuit Boards) are made from high-performance engineered materials manufactured by Rogers Corporation. These materials typically include various types of PTFE (polytetrafluoroethylene) composites, ceramic substrates, and other specialized materials. The production process for Rogers PCBs differs from conventional PCBs in several ways:

Material Selection:

The materials used in Rogers PCBs possess specific high-performance properties, such as low dielectric constant, low dissipation factor, and high thermal conductivity. These properties are critical for high-frequency, high-speed, or high-power applications.

Lamination Process:

Rogers materials may require specialized lamination processes to ensure bond strength and flatness between materials. These processes may involve specific conditions such as high temperature and high pressure.

Drilling and Machining:

Because the mechanical properties of Rogers materials differ from those of conventional materials like FR-4, drilling and machining processes may require adjustments to parameters such as drill bit type, feed rate, and rotational speed to avoid damage to the board.

Surface Finish:

Rogers PCBs may require specialized surface treatment to ensure good soldering performance and circuit reliability.

Thermal Management:

High-performance boards may have improved thermal conductivity, so thermal management considerations, such as using appropriate thermal pads or heat sinks, must be considered during PCB design and production.

Electrical Property Control:

During production, the board's electrical properties, such as dielectric constant and dissipation factor, must be strictly controlled to meet the requirements of high-frequency and high-speed applications.

Quality Inspection:

Rogers PCBs may require a more rigorous quality inspection process, including testing of the board's electrical, mechanical, and thermal properties.

Environmental Control:

The production environment may require stricter controls to prevent contaminants from affecting the board's electrical performance.

Design Software and Manufacturing Processes:

Designing and manufacturing Rogers PCBs may require specialized software and processes tailored to their unique material properties.

Supply Chain Management:

Due to the unique nature of Rogers materials, supply chain management may be more stringent to ensure material quality and continuity of supply.

Rogers PCB production processes are optimized for the unique properties of the materials to meet the high demands of specific applications. These specialized processes contribute to higher-performance electronic devices, especially those with stringent requirements for signal integrity, thermal management, and reliability.